Job openings for SE Electronic Packaging, Multiple Clients of Vati! - Best Places to work!, New Delhi / NCR Mumbai

Mechanical Designer (Electronic Packaging) JC26                                             MP

• Design and Engineering of Packaging for family of products related to 3G/4G Wireless Systems like WiMAX, LTE & GSM Base Stations as per  Standards like IEC, NEBS, ETSI, etc
• Analyze Mechanical Design and System Engineering aspects including Cable management of products from Conceptual stage to Prototype development and manufacturing.
• Thermal Management of Telecommunication equipments using CFD (Computational Fluid Dynamics) software packages for Thermal Simulation at the Board & Chassis level to predict Air Flow and Heat Transfer with coupled effects of Conduction, Convection & Radiation.
• Mechanical Design and Drawing generation of Mechanical components like precision Sheet metal, Machined, Metal Die-cast and Injection Molded Plastic parts for Telecom equipments using 3D CAD Tools.
• Analyze Product Design and Integration of PCB’s with Mechanical Housings for EMI/EMC, Mechanical (Shock, Vibration, Acoustics) and Environmental testing.
• Generation of Cable assembly & Layout drawings, Process Control documents, Release of drawings, Change control and Prototype development.

• 3-4 years experience in Electronics Packaging & Thermal Design.

• Expertise in 3D Modeling (CAD) tools like ProEngineer, Solidworks, Unigraphics-IDEAS and AutoCAD.

• Expertise in for Thermal Simulation softwares like Flotherm, Icepack, etc for Thermal Management of Telecom equipments.

• Good understanding of Sheet Metal operations, Press Tools, Metal Machining, Plastic Materials, Plastic Injection Moulds & Dies.

• Proficiency in Graphics design tools like CorelDraw, Photoshop, etc

• Proficiency in Vendor Development and Interaction activities for Proto-development.

B.E or above with one of the following Specialization and 70% or more in academics

Mechanical Engineer

Production Engineer